Patent Assignment
Reel/Frame 029618/0142
Assignment of Assignor's Interest
Recorded: 2013-01-14
Pages: 10
Assignors
HUNG, CHING-WEN
Executed: 2013-01-07
LIOU, EN-CHIUAN
Executed: 2013-01-07
HUANG, CHIH-SEN
Executed: 2013-01-07
TSAO, PO-CHAO
Executed: 2013-01-07
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method of Forming Semiconductor Structure Having Contact Plug