Patent Assignment
Reel/Frame 029651/0389
Assignment of Assignor's Interest
Recorded: 2013-01-17
Pages: 2
Assignors
YOSHIKAWA, EIJI
Executed: 2012-11-08
ICHIKAWA, JYUNICHI
Executed: 2012-11-08
YOSHIDA, YUKIHISA
Executed: 2012-11-08
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Soi Wafer, Manufacturing Method Therefor, and Mems Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.