IP Library Assignment 029692/0092
Patent Assignment
Reel/Frame 029692/0092

Assignment of Assignor's Interest

Recorded: 2013-01-25 Pages: 6
Assignors
MORAND, YVES
Executed: 2013-01-17
BATUDE, PERRINE
Executed: 2013-01-17
Assignees
STMICROELECTRONICS S.A.
29, BOULEVARD ROMAIN ROLLAND, MONTROUGE, 92120, FRANCE
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
BATIMENT LE PONANT D, 25 RUE LEBLANC, PARIS, 75015, FRANCE
Covered Property (1)
Method for Forming a via Contacting Several Levels of Semiconductor Layers
Patent: 8,722,471 →
Application: 13/748,126 →
Publication: US 2013/0196500
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 21, 2024
From: STMICROELECTRONICS SA
To: STMICROELECTRONICS FRANCE
Reel/Frame 066357/0693 →