Patent Assignment
Reel/Frame 029748/0699
Assignment of Assignor's Interest
Recorded: 2013-02-04
Pages: 2
Assignor
YUN, KI JUN
Executed: 2013-01-28
Assignee
DONGBU HITEK CO., LTD.
90, SUDO-RO, WONMI-GU, BUCHEON-SI, GYEONGGI-DO, 420-712, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Contact and Semiconductor Device Manufactured by Using the Method
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.