Patent Assignment
Reel/Frame 029752/0221
Assignment of Assignor's Interest
Recorded: 2013-02-05
Pages: 3
Assignors
LOPEZ, OSVALDO JORGE
Executed: 2013-01-29
NOQUIL, JONATHAN ALMERIA
Executed: 2013-01-29
HERBSOMMER, JUAN
Executed: 2013-01-31
Assignee
TEXAS INSTRUMENTS INCORPORATED
MS 3999, 12500 TI BOULEVARD, DALLAS, TEXAS, 75243
Covered Property
(1)
An Integrated Circuit ("Ic") Assembly Includes an Ic Die with a Top Metallization Layer and a Conductive Epoxy Layer Applied to the Top Metallization Layer