Patent Assignment
Reel/Frame 029813/0196
Assignment of Assignor's Interest
Recorded: 2013-02-14
Pages: 3
Assignors
BOND, ROBERT HENRY
Executed: 2010-03-04
KRAMER, ALAN
Executed: 2010-03-04
GOZZINI, GIOVANNI
Executed: 2010-03-04
Assignee
UPEK, INC.
5900 CHRISTIE AVE., EMERYVILLE, CALIFORNIA, 94608
Covered Property
(1)
Integrally Molded Die and Bezel Structure for Fingerprint Sensors and the Like
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.