Assignment of Assignor's Interest

Recorded: 2013-02-18 Pages: 5

Assignors

HIRAYAMA, MASAKI

Executed: 2013-01-16

OHMI, TADAHIRO

Executed: 2013-01-15

Assignees

TOHOKU UNIVERSITY

2-1-1, KATAHIRA, AOBA-KU, SENDAI-SHI, MIYAGI, 980-8577, JAPAN

TOKYO ELECTRON LIMITED

3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN

Covered Property (1)

Plasma Processing Apparatus and Plasma Processing Method

Patent: 9,095,039 →

Application: 13/809,990 →

Publication: US 2013/0140984