IP Library › Assignment 029867/0588
Patent Assignment
Reel/Frame 029867/0588

Merger

Recorded: 2013-02-25 Pages: 2
Assignor
Assignee
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
NO. 1 YISHUN AVENUE 7, SINGAPORE, 768923, SINGAPORE
Covered Property (1)
Systems and Methods for Low Profile Die Package
Patent: 8,211,748 →
Application: 11/511,175 →
Publication: US 2008/0048302
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 5, 2006
From: LEE, HUN K.; TAI, LI C.; LEE, SAI M.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 018354/0490 →
Assignment of Assignor's Interest Mar 27, 2007
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
Reel/Frame 019070/0024 →
Assignment of Assignor's Interest Nov 5, 2013
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE.LTD.
To: PIXART IMAGING INC.
Reel/Frame 031541/0278 →