Patent Assignment
Reel/Frame 029881/0244
Assignment of Assignor's Interest
Recorded: 2013-02-26
Pages: 3
Assignors
SAKAMOTO, YOSHITSUGU
Executed: 2011-09-03
YAMADA, HIROYUKI
Executed: 2011-09-03
YAMANAKA, YOSHIE
Executed: 2011-08-05
OHNISHI, TSUKASA
Executed: 2011-08-06
YOSHIKAWA, SHUNSAKU
Executed: 2011-08-05
TADOKORO, KENZO
Executed: 2011-08-24
Assignee
SENJU METAL INDUSTRY CO., LTD.
23 SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO, 120-8555, JAPAN
Covered Property
(1)
Bonding Material for Semiconductor Devices