Patent Assignment
Reel/Frame 029918/0493
Assignment of Assignor's Interest
Recorded: 2013-03-04
Pages: 3
Assignor
YEN, HAN-CHEE
Executed: 2013-02-26
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Including Antenna Substrate and Manufacturing Method Thereof