Assignment of Assignor's Interest

Recorded: 2013-03-11 Pages: 5

Assignors

GAO, HONGTAO

Executed: 2013-02-25

ZHANG, JIANG YUAN

Executed: 2013-03-02

Assignee

DIODES INCORPORATED

4949 HEDGCOXE ROAD, SUITE 200, PLANO, TEXAS, 75024

Covered Property (1)

Ultra-Small Chip Package and Method for Manufacturing the Same

Patent: 8,704,344 →

Application: 13/647,180 →

Publication: US 2013/0147029

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.