IP Library Assignment 029965/0877
Patent Assignment
Reel/Frame 029965/0877

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2013-03-11 Received: 2013-03-11 Pages: 3
Assignors
LEE, MENG EE
Executed: 2013-03-07
LIM, SEONG CHOON
Executed: 2013-03-07
ONG, ENG CHUAN
Executed: 2013-03-07
Assignee
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
NO. 1 YISHUN AVENUE 7, SINGAPORE, SGX, 768923, SINGAPORE
Covered Application (1)
ELECTRONIC PACKAGING SUBSTRATE WITH ETCHING INDENTATION AS DIE ATTACHMENT ANCHOR AND METHOD OF MANUFACTURING THE SAME
App. No. 13/793,949