Patent Assignment
Reel/Frame 029999/0847
Assignment of Assignor's Interest
Recorded: 2013-03-14
Pages: 2
Assignors
PAN, KUO LUNG
Executed: 2013-03-12
HSIAO, CHING-WEN
Executed: 2013-03-12
CHEN, CHEN-SHIEN
Executed: 2013-03-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Warpage Control of Semiconductor Die Package