Patent Assignment
Reel/Frame 030016/0110
Assignment of Assignor's Interest
Recorded: 2013-03-15
Pages: 3
Assignors
YIN, HUNG-LIN
Executed: 2013-03-12
HSIEH, JERWEI
Executed: 2013-03-12
LIN, LI-YUAN
Executed: 2013-03-12
Assignee
ASIA PACIFIC MICROSYSTEMS, INC.
NO. 2, R & D ROAD 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU CITY 300, ROC, TAIWAN
Covered Property
(1)
Package Structure and Substrate Bonding Method