Patent Assignment
Reel/Frame 030019/0009
Assignment of Assignor's Interest
Recorded: 2013-03-15
Pages: 4
Assignors
HUNG, JUI-PIN
Executed: 2013-03-06
LIN, JING-CHENG
Executed: 2013-03-01
TSAI, PO-HAO
Executed: 2013-03-06
LIN, YI-JOU
Executed: 2013-03-04
CHEN, SHUO-MAO
Executed: 2013-03-04
YEH, CHIUNG-HAN
Executed: 2013-03-05
YEH, DER-CHYANG
Executed: 2013-03-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Fabricating Interconnect Structure for Package-on-Package Devices