Patent Assignment
Reel/Frame 030055/0539
Assignment of Assignor's Interest
Recorded: 2013-03-20
Pages: 7
Assignors
HABA, BELGACEM
Executed: 2009-08-21
RYU, CHANG MYUNG
Executed: 2009-09-17
ENDO, KIMITAKA
Executed: 2009-09-18
WADE, CHRISTOPHER PAUL
Executed: 2009-09-03
Assignee
TESSERA INTERCONNECT MATERIALS, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Microelectronic Substrate or Element Having Conductive Pads and Metal Posts Joined Thereto Using Bond Layer
Application:
13/795,473 →
Publication:
US 2013/0186944