Patent Assignment
Reel/Frame 030110/0421
Assignment of Assignor's Interest
Recorded: 2013-03-28
Pages: 4
Assignors
OOI, TOONG ERH
Executed: 2013-03-19
CHEAH, BOK ENG
Executed: 2013-03-20
NIMKAR, NITESH
Executed: 2013-03-21
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Embedded Die-Down Package-on-Package Device