IP Library Assignment 030118/0451
Patent Assignment
Reel/Frame 030118/0451

Assignment of Assignor's Interest

Recorded: 2013-03-29 Pages: 12
Assignors
GEALER, CHARLES A.
Executed: 2012-11-13
ZARBOCK, EDWARD A.
Executed: 2012-12-03
SWAN, JOHANNA M.
Executed: 2012-11-12
MA, QING
Executed: 2012-11-13
TAO, MIN
Executed: 2012-12-03
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Interposer for Hermetic Sealing of Sensor Chips and for Their Integration with Integrated Circuit Chips
Patent: 9,368,429 →
Application: 13/631,744 →
Publication: US 2013/0249109