IP Library › Assignment 030121/0671
Patent Assignment
Reel/Frame 030121/0671

Assignment of Assignor's Interest

Recorded: 2013-04-01 Pages: 4
Assignors
SHIOGA, TAKESHI
Executed: 2013-03-01
NAGAOKA, HIDEAKI
Executed: 2013-03-01
KIMURA, TAKAHIRO
Executed: 2013-03-01
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8588, JAPAN
Covered Property (1)
Semiconductor Package, Cooling Mechanism and Method for Manufacturing Semiconductor Package
Patent: 9,142,476 →
Application: 13/854,216 →
Publication: US 2013/0223010
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 27, 2024
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069454/0333 →
Assignment of Assignor's Interest Dec 17, 2025
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073964/0516 →