IP Library Assignment 030158/0567
Patent Assignment
Reel/Frame 030158/0567

Assignment of Assignor's Interest

Recorded: 2013-04-05 Pages: 6
Assignors
GOH, KOK CHAI
Executed: 2013-04-01
ONG, MENG TONG
Executed: 2013-03-22
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property (1)
High Power Single-Die Semiconductor Package
Patent: 9,054,063 →
Application: 13/857,252 →
Publication: US 2014/0299981