Patent Assignment
Reel/Frame 030187/0451
Assignment of Assignor's Interest
Recorded: 2013-04-10
Pages: 7
Assignors
HU, CHUAN
Executed: 2013-04-04
MA, QING
Executed: 2013-04-04
CHIU, CHIA-PIN
Executed: 2013-04-04
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Integrated Circuit Package Assemblies Including a Glass Solder Mask Layer