Patent Assignment
Reel/Frame 030198/0349
Assignment of Assignor's Interest
Recorded: 2013-04-11
Pages: 12
Assignors
YIN, JIAN
Executed: 2013-04-10
KELKAR, NIKHIL VISHWANATH
Executed: 2013-04-05
CARPENTER, LOYDE MILTON, JR.
Executed: 2013-04-05
Assignee
INTERSIL AMERICAS LLC
1001 MURPHY RANCH ROAD, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Method of Manufacturing a Packaged Circuit Including a Lead Frame and a Laminate Substrate