Patent Assignment
Reel/Frame 030242/0050
Assignment of Assignor's Interest
Recorded: 2013-04-12
Pages: 3
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Semiconductor Device and Production Method of the Same Including Multilayer Interconnection Layer, Wiring Layer, and Redistribution Layer
Application:
13/859,190 →
Publication:
US 2013/0285247
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.