Patent Assignment
Reel/Frame 030286/0802
Assignment of Assignor's Interest
Recorded: 2013-04-25
Pages: 2
Assignors
LEE, JAE DON
Executed: 2013-04-19
SHIN, YOUNG SAM
Executed: 2013-04-19
LEE, WON JONG
Executed: 2013-04-19
LEE, SHI HWA
Executed: 2013-04-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus and Method for Traversing Hierarchical Acceleration Structure