Patent Assignment
Reel/Frame 030340/0022
Assignment of Assignor's Interest
Recorded: 2013-05-02
Pages: 4
Assignors
XIE, JIANYOU
Executed: 2013-05-02
LI, XIZHOU
Executed: 2013-05-02
MU, WEI
Executed: 2013-05-02
WANG, YONGZHONG
Executed: 2013-05-02
WEI, HAIDONG
Executed: 2013-05-02
Assignee
TIANSHUI HUATIAN TECHNOLOGY CO., LTD.
NO.14, SHUANGQIAO ROAD, QINZHOU DISTRICT, TIANSHUI, GANSU, 741000, CHINA
Covered Property
(1)
Sip System-Integration Ic Chip Package and Manufacturing Method Thereof