Patent Assignment
Reel/Frame 030368/0739
Assignment of Assignor's Interest
Recorded: 2013-05-07
Pages: 3
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Integrating Through Substrate Vias from Wafer Backside Layers of Integrated Circuits