Patent Assignment
Reel/Frame 030371/0484
Assignment of Assignor's Interest
Recorded: 2013-05-08
Pages: 4
Assignors
MENG, HSIEN-LIANG
Executed: 2013-03-19
LIN, WEI-HUNG
Executed: 2013-03-20
LIANG, JIMMY
Executed: 2013-03-19
HO, MING-CHE
Executed: 2013-03-19
KUO, HUNG-JUI
Executed: 2013-03-19
LIU, CHUNG-SHI
Executed: 2013-03-19
LII, MIRNG-JI
Executed: 2013-03-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package Structures and Methods for Forming the Same