Assignment of Assignor's Interest

Recorded: 2013-05-09 Pages: 2

Assignor

WATANABE, KENICHI

Executed: 2013-02-12

Assignee

FUJITSU SEMICONDUCTOR LIMITED

2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN

Covered Properties (4)

Semiconductor Device Having Groove-Shaped Via-Hole

Patent: 8,853,861 →

Application: 13/780,174 →

Publication: US 2013/0175691

Semiconductor Device Having Groove-Shaped Via-Hole

Patent: 8,872,352 →

Application: 13/780,236 →

Publication: US 2013/0168799

Semiconductor Device Having Groove-Shaped Via-Hole

Patent: 8,872,353 →

Application: 13/780,311 →

Publication: US 2013/0175692

Semiconductor Device Including Two Groove-Shaped Patterns

Patent: 8,847,403 →

Application: 13/780,396 →

Publication: US 2013/0168865

Related Assignments (1)

Other recorded transfers of the patents in this record — the chain of ownership.