IP Library Assignment 030401/0187
Patent Assignment
Reel/Frame 030401/0187

Assignment of Assignor's Interest

Recorded: 2013-05-13 Pages: 4
Assignors
LIAO, CHIN-I
Executed: 2013-05-08
CHIEN, CHIN-CHENG
Executed: 2013-05-08
Assignee
UNITED MICROELECTRONICS CORP.
NO3, LI-HSIN RD.II, HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property (1)
Gradient Dopant of Strained Substrate Manufacturing Method of Semiconductor Device
Patent: 9,064,893 →
Application: 13/892,424 →
Publication: US 2014/0335674