IP Library Assignment 030435/0287
Patent Assignment
Reel/Frame 030435/0287

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2013-05-17 Received: 2013-05-17 Pages: 8
Assignors
BATHAN, HENRY DESCALZO
Executed: 2013-05-09
DO, BYUNG TAI
Executed: 2013-05-09
ESPIRITU, EMMANUEL
Executed: 2013-05-09
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application (1)
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PLATED LEADS AND METHOD OF MANUFACTURE THEREOF
App. No. 13/896,608