Assignment of Assignor's Interest

Recorded: 2013-05-21 Pages: 4

Assignor

MIYASHITA, KIMIYA

Executed: 2013-05-07

Assignees

KABUSHIKI KAISHA TOSHIBA

1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN

TOSHIBA MATERIALS CO., LTD.

8, SHINSUGITA-CHO, ISOGO-KU, YOKOHAMA-SHI, KANAGAWA-KEN, 235-0032, JAPAN

Covered Property (1)

Ceramic Heat Sink Material for Pressure Contact Structure and Semiconductor Module Using the Same

Patent: 9,057,569 →

Application: 13/988,555 →

Publication: US 2013/0241046

Related Assignments (3)

Other recorded transfers of the patent in this record — the chain of ownership.