IP Library Assignment 030477/0767
Patent Assignment
Reel/Frame 030477/0767

Assignment of Assignor's Interest

Recorded: 2013-05-23 Pages: 2
Assignors
LIN, JING-CHENG
Executed: 2013-05-16
HUANG, CHENG-LIN
Executed: 2013-05-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Integrated Circuit Structure Having Dies with Connectors
Patent: 9,299,680 →
Application: 13/901,279 →
Publication: US 2014/0264843