Patent Assignment
Reel/Frame 030504/0808
Assignment of Assignor's Interest
Recorded: 2013-05-29
Pages: 3
Assignors
SATO, JUNJI
Executed: 2013-04-02
NOMURA, TOMOHIRO
Executed: 2013-04-02
OSHIMA, KAZUHIRO
Executed: 2013-04-02
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Electronic Component Built-in Substrate and Method of Manufacturing the Same