Patent Assignment
Reel/Frame 030527/0795
Assignment of Assignor's Interest
Recorded: 2013-05-31
Pages: 4
Assignors
HWANG, YONG-WOOK
Executed: 2013-05-20
CHO, SUNG-HO
Executed: 2013-05-20
MOON, HEE-CHEUL
Executed: 2013-05-20
BAEK, SEUNG-CHANG
Executed: 2013-05-20
PARK, CHAN-SEOB
Executed: 2013-05-20
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Cover Having Metallic Grid Structure and Method for Manufacturing the Cover