Patent Assignment
Reel/Frame 030533/0205
Assignment of Assignor's Interest
Recorded: 2013-06-03
Pages: 4
Assignor
JANG, JAE-JUNE
Executed: 2013-05-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Forming the Same