Patent Assignment
Reel/Frame 030556/0895
Assignment of Assignor's Interest
Recorded: 2013-06-06
Pages: 5
Assignors
SHIEH, MING-FENG
Executed: 2013-05-14
TSENG, WEN-HUNG
Executed: 2013-05-14
LAI, CHIH-MING
Executed: 2013-05-14
HSIEH, KEN-HSIEN
Executed: 2013-05-15
GAU, TSAI-SHENG
Executed: 2013-05-16
LIU, RU-GUN
Executed: 2013-05-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Multi-Layer Metal Contacts