Patent Assignment
Reel/Frame 030562/0864
Assignment of Assignor's Interest
Recorded: 2013-06-06
Pages: 4
Assignors
CHEN, HSIEN-WEI
Executed: 2013-05-07
YU, TSUNG-YUAN
Executed: 2013-05-07
TSAI, HAO-YI
Executed: 2013-05-07
LII, MIRNG-JI
Executed: 2013-05-08
YU, CHEN-HUA
Executed: 2013-05-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Packaging Devices and Methods of Manufacture Thereof