Patent Assignment
Reel/Frame 030574/0205
Assignment of Assignor's Interest
Recorded: 2013-06-06
Received: 2013-06-06
Pages: 3
Assignor
LIN, MOU-SHIUNG
Executed: 2004-03-16
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE BASED, HSIN-CHU, TWX, 300, TAIWAN
Covered Property
(1)
High Performance Ic Chip Having Discrete Decoupling Capacitors Attached to Its Ic Surface
Application:
13/735,894 →