IP Library Assignment 030605/0612
Patent Assignment
Reel/Frame 030605/0612

Assignment of Assignor's Interest

Recorded: 2013-06-13 Pages: 4
Assignors
CONTI, SEBASTIANO
Executed: 2013-06-05
VIGNA, BENEDETTO
Executed: 2013-06-05
Assignees
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI 2, AGRATE BRIANZA, 20864, ITALY
STMICROELECTRONICS INTERNATIONAL N.V.
WTC SCHIPHOL AIRPORT, SCHIPHOL BOULEVARD 265, SCHIPHOL AIRPORT, AMSTERDAM, 1118BH, NETHERLANDS
Covered Property (1)
Semiconductor Integrated Device Assembly and Related Manufacturing Process
Patent: 8,836,111 →
Application: 13/916,416 →
Publication: US 2013/0334627
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 7, 2022
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060301/0355 →