Patent Assignment
Reel/Frame 030619/0172
Assignment of Assignor's Interest
Recorded: 2013-06-14
Pages: 4
Assignor
MEGIC CORPORATION
Executed: 2006-04-28
Assignee
MEGICA CORPORATION
ROOM 301/302, NO.47, PARK 2ND RD.,, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Methods for Fabricating an Integrated Circuit Having a Post-Passivation Thin-Film Resistor
Application:
13/851,050 →
Publication:
US 2013/0214387
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 14, 2013
From: LIN, MOU-SHIUNG
To: MEGIC CORPORATION
Reel/Frame 030619/0158 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →