IP Library Assignment 030621/0455
Patent Assignment
Reel/Frame 030621/0455

Assignment of Assignor's Interest

Recorded: 2013-06-06 Pages: 3
Assignors
CHIANG, CHIU-CHIH
Executed: 2007-05-10
HUANG, CHIH-FENG
Executed: 2007-05-10
Assignee
SYSTEM GENERAL CORP.
3F, NO. 1, ALLEY 8, LANE 45,, BAO SHING ROAD, SHIN DIAN, TAIPEI, R.O.C., TAIWAN
Covered Property (1)
Semiconductor structure with high breakdown voltage and resistance
Patent: 8,492,801 →
Application: 11/798,206 →
Publication: US 2008/0278279
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 2, 2016
From: SYSTEM GENERAL CORP.
To: FAIRCHILD (TAIWAN) CORPORATION
Reel/Frame 038594/0168 →
Assignment of Assignor's Interest Apr 25, 2017
From: FAIRCHILD (TAIWAN) CORPORATION (FORMERLY SYSTEM GENERAL CORPORATION)
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 042328/0318 →
Patent Security Agreement Jun 22, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046410/0933 →
Release of Security Interest in Patents Recorded at Recorded at Reel 046410, Frame 0933 Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064072/0001 →