Patent Assignment
Reel/Frame 030635/0157
Assignment of Assignor's Interest
Recorded: 2013-06-18
Pages: 3
Assignee
NITTO DENKO CORPORATION
1-2, SHIMO-HOZUMI 1-CHOME, IBARAKI-SHI, OSAKA, 567-8680, JAPAN
Covered Property
(1)
Wired Circuit Board Including an Insulating Layer Formed with an Opening Filled with a Conductive Portion and Producing Method Thereof