Patent Assignment
Reel/Frame 030670/0007
Assignment of Assignor's Interest
Recorded: 2013-06-24
Pages: 3
Assignors
IDE, EIICHI
Executed: 2012-12-25
HIRAMITSU, SHINJI
Executed: 2013-01-18
HOZOJI, HIROSHI
Executed: 2012-12-25
TSUYUNO, NOBUTAKE
Executed: 2012-12-19
NAKATSU, KINYA
Executed: 2012-12-19
TOKUYAMA, TAKESHI
Executed: 2012-12-19
MATSUSHITA, AKIRA
Executed: 2012-12-26
TAKAGI, YUSUKE
Executed: 2012-12-26
Assignee
HITACHI AUTOMOTIVE SYSTEMS, LTD.
2520, TAKABA, HITACHINAKA-SHI, IBARAKI, JAPAN
Covered Property
(1)
Power Semiconductor Module and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.