Patent Assignment
Reel/Frame 030760/0078
Assignment of Assignor's Interest
Recorded: 2013-07-09
Pages: 3
Assignors
LIU, MONSEN
Executed: 2013-06-17
WANG, CHUEI-TANG
Executed: 2013-06-17
CHIH, LAI WEI
Executed: 2013-06-17
YU, CHEN-HUA
Executed: 2013-06-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
3D Shielding Case and Methods for Forming the Same