IP Library › Assignment 030765/0824
Patent Assignment
Reel/Frame 030765/0824

Assignment of Assignor's Interest

Recorded: 2013-07-10 Pages: 8
Assignors
CHOU, CHIU-MING
Executed: 2006-05-04
LIU, YI-CHENG
Executed: 2006-05-04
LEE, JIN-YUAN
Executed: 2006-05-04
LIN, MOU-SHIUNG
Executed: 2006-05-08
LEE, WEN-CHIEH
Executed: 2006-05-03
CHOU, CHIEN-KANG
Executed: 2006-05-03
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Property (1)
Semiconductor Chip with Coil Element Over Passivation Layer
Patent: 7,985,653 →
Application: 12/276,419 →
Publication: US 2009/0104769
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →