Patent Assignment
Reel/Frame 030767/0466
Assignment of Assignor's Interest
Recorded: 2013-07-10
Pages: 3
Assignee
MEGIC CORPORATION
21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Property
(1)
Multiple Chips Bonded to Packaging Structure with Low Noise and Multiple Selectable Functions
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.