IP Library › Assignment 030774/0980
Patent Assignment
Reel/Frame 030774/0980

Assignment of Assignor's Interest

Recorded: 2013-07-11 Pages: 4
Assignors
HUANG, CHING-CHENG
Executed: 2001-01-21
LIN, CHUEN-JYE
Executed: 2001-01-21
LEI, MING-TA
Executed: 2001-01-21
LIN, MOU-SHIUNG
Executed: 2001-01-21
Assignee
MEGIC CORPORATION
21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Property (1)
Reliable Metal Bumps on Top of I/O Pads After Removal of Test Probe Marks
Patent: 7,465,653 →
Application: 10/962,964 →
Publication: US 2005/0070085
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →