Patent Assignment
Reel/Frame 030786/0262
Assignment of Assignor's Interest
Recorded: 2013-07-12
Pages: 4
Assignee
SAND 9, INC.
ONE KENDALL SQUARE, SUITE B2305, CAMBRIDGE, MASSACHUSETTS, 02139-1594
Covered Property
(1)
Wafer Bonding and Related Methods and Apparatus
Application:
13/859,363 →
Publication:
US 2014/0077316
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.