Patent Assignment
Reel/Frame 030797/0172
Assignment of Assignor's Interest
Recorded: 2013-07-15
Pages: 3
Assignor
DIAS, RAJEN C.
Executed: 2013-03-14
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Laser Die Backside Film Removal for Integrated Circuit (Ic) Packaging
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.