Patent Assignment
Reel/Frame 030814/0168
Assignment of Assignor's Interest
Recorded: 2013-07-17
Pages: 2
Assignor
LIN, JING-CHENG
Executed: 2013-07-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Hybrid Bonding with Through Substrate via (Tsv)